Intel

https://www.intel.com
https://www.linkedin.com/company/intel-corporation/

Intel, also known as Intel Corporation, is a publicly owned company headquartered in the US. Founded in 1968, the company employs approximately 155,670 individuals and reported $52.9B in revenue as of 2025. Its main product is semiconductor manufacturing. The company designs and manufactures microprocessors for the personal computer and data center markets.

2025 Revenue

Founded

1968

Headcount

155,670

Headquarters

Primary Segment

Semiconductor Manufacturing

Ownership

Publicly Owned

Deployments

News Summary:

On May 2, 2026, Intel ramped up manufacturing of its CPUs on its 18A (1.8nm-class) process technology, while development for the enhanced 18A-P version is underway with manufacturing readiness anticipated in the coming quarters.

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Intel offers 5 products in the connectivity and cloud, telecoms tech and media and telecoms services industries. Intel's product portfolio comprises of enterprise cloud, consumer electronics and enterprise and telecoms software.

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Intel's revenues were $52.9B in 2025. Caretta Research has split Intel's revenue into 4 different product categories, the largest of which is cloud compute, which represents 39% of Intel's revenue.

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May

30th

2026

08:07

Emerging Tech, Partnerships and Alliances, B2B Tag

Vedanta Resources, Intel, and 3DGS Collaborate on Advanced Packaging and Semiconductor Technologies

Vedanta Resources, Intel, and 3DGS have collaborated to establish India as a key global hub for advanced glass substrates and semiconductor packaging. The partnership aims to accelerate the commercialization of next-generation advanced packaging solutions globally.

Bombay Stock Exchange

May

30th

2026

07:31

Emerging Tech, Partnerships and Alliances, B2B Tag

Backed Substrate Manufacturing Facility Planned In Odisha Under New MoU

New Delhi: In a significant development for India’s semiconductor ambitions, substrate manufacturing is set to receive a major boost following the signing of a landmark Memorandum of Understanding (MoU) between the Government of Odisha, Intel Corporation, and 3DGS Inc., USA.

Sahyadri Startups

May

30th

2026

02:17

Emerging Tech, Artificial Intelligence, B2B Tag

Taiwan's MediaTek says it supports both TSMC and Intel's advanced packaging technologies

TAIPEI: Taiwan chip designer said on Friday it supports both 's and 's , allowing customers to choose between the two approaches. "We're one of the few custom silicon providers that support both (TSMC's) CoWoS and (Intel's) EMIB.

ET Telecom

May

30th

2026

01:40

Capital Investment, Procurement and Sales, B2B Tag

Intel’s US$3.3b India Plant Raises Questions On Growth And Valuation

Intel (NasdaqGS:INTC) and 3DGS plan to build a substrate manufacturing plant in Odisha, India, with a joint investment of US$3.3b. The project is intended to support growth in India's semiconductor ecosystem and expand regional supply chain capacity.

Simply Wall Street

May

30th

2026

01:00

B2B Tag

What's the progress of the industrialization of glass substrates?

At the CSPTxITG V2026 conference on glass substrates, a set of exciting data emerged: As the core material for next-generation advanced packaging, glass substrates are entering an accelerated period of industrialization. The global market size is expected to grow rapidly from $1.48 billion in 2024 to $2.33 billion in 2034.

36Kr

May

29th

2026

23:21

ESG, Artificial Intelligence, B2B Tag

Beyond GPUs: How Intel and Wipro Are Powering Sustainable Enterprise AI with CPUs

Beyond GPUs: How Intel and Wipro Are Powering Sustainable Enterprise AI with CPUs In this video, Pushpa Ramachandran, Vice President - Head of Data & Decision Sciences at Wipro, and Raghavendra Ural, Director of Engineering for Datacenter AI Solutions at Intel, share how the strategic partnership between Intel and Wipro is driving a meaningful shift in enterprise AI adoption.

Wipro

May

29th

2026

19:30

Emerging Tech, Artificial Intelligence, B2B Tag

Production Inference in the Enterprise: Lessons from Testing Intel® Gaudi® 3

Enterprise AI has entered a new phase. The early questions, “Can we run generative AI?” and “Which model should we try?” have largely been answered. The harder question now is operational: How do we run inference reliably, predictably, and cost-effectively at scale? As models move from pilot environments into production systems that serve thousands of users and applications, inference becomes the dominant workload.

AHEAD US

May

29th

2026

17:45

Operational Challenges, Procurement and Sales, Emerging Tech, B2B Tag

Semiconductor Test Equipment Makers Face 'Worst

Semiconductor test equipment makers are facing a severe component supply crunch, prompting complaints that "there are no semiconductors available to build semiconductor test equipment." According to industry sources on May 29, procurement conditions for key parts used in semiconductor test equipment have deteriorated sharply.

THE ELEC

May

29th

2026

17:02

Capital Investment, Partnerships and Alliances, Emerging Tech, B2B Tag

Odisha bags mega semiconductor project worth USD 3.3 billion, signs landmark pact with Intel, 3DGS

In a major boost to India’s semiconductor and high-technology manufacturing ambitions, the Odisha government, Intel Corporation, and US-based 3D Glass Solutions Inc (3DGS) have signed a tripartite memorandum of understanding to establish an advanced packaging glass core substrate manufacturing facility in the state.

ETNow India

May

29th

2026

16:44

Emerging Tech, B2B Tag

Intel Corp Common Stock Sale Notice Under Rule 144

Intel Corp common stock sale notice filed by Chandrasekaran Nagasubramaniyan, with 21024 shares to be sold, acquired on 04/30/20, and valued at $2541591.00. The sale is to be made on NASDAQ on 05/29/20.

Intc

May

29th

2026

16:34

Emerging Tech, Artificial Intelligence, B2B Tag

MediaTek Supports Both TSMC and Intel Technologies for Advanced Chip Packaging

MediaTek is now backing both TSMC and Intel for advanced chip packaging, positioning itself as a rare neutral player in the AI silicon arms race. The Taiwan-based chip designer confirmed Friday it supports TSMC's CoWoS (Chip-on-Wafer-on-Substrate) and Intel's EMIB (Embedded Multi-die Interconnect Bridge) technologies, letting customers pick their packaging approach.

Technobezz

May

29th

2026

14:36

Emerging Tech, Partnerships and Alliances, B2B Tag

Intel, 3DGS to set up $3.3 billion substrate plant in Odisha

Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state. Union Minister of Electronics and IT Ashwini Vaishnaw along with Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan, and other dignitaries witnessed the signing of the MoU to bring substrate manufacturing technology to India.

The Statesman

Intel has commercial and technical partners like Tata Consultancy Services, IBM and Accenture. Examples of Intel's suppliers include Red5 Pro, Synopsys and WellSaid Labs.

Analysis

Data

Analysis

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Intel

2025 Revenue

Founded

Headcount

Headquarters

Primary Segment

Ownership

Deployments

News Summary:

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